Desoldering Braid Chem-Wick 2.0mm 1.5m (5ft/0.075") NoClean, for solder desoldering/removal, Chemtronics, USA.
Chem-Wik® Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik® Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact” pressure for greater operator control. All sizes are coated with a Type “R” organic flux system.
Applications:
Chem-Wik® Rosin desoldering braid safely removes solder from: Thru-hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts, Identification Script and more.
Benefits:
Chem-Wik® Rosin 5' spools packaged in ESD-safe static dissipative bobbins, requires little or no post solder cleaning, no corrosive residues, optimized weave design for faster wicking and heat transfer, halide free, coated with ultra high purity, noncorrosive, Type R rosin flux, quickly and thoroughly removes solder and fast wicking action protects components from harmful heat damage
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